Surface mounting technology - Standard method for the specification of components for through hole reflow (THR) soldering

BS EN 61760-3:2010 Surface mounting technology. Standard method for the specification of components for through hole reflow (THR) soldering

BS EN 61760-3 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology.

The object of BS EN 61760-3 is to ensure that components with leads intended for through hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this standard defines test and requirements that need to be part of any component generic, sectional or detail specification, when through hole reflow soldering is intended. Further this standard provides component users and manufacturers with a reference set of typical process conditions used in through hole reflow soldering technology.

Contents of BS EN 61760-3:

Scope and object

2 Normative references

3 Terms and definitions

4 Requirements to component design and component specifications

4.1 General requirement

4.2 Packaging

4.3 Labelling of product packaging

4.4 Component marking

4.5 Storage and transportation

4.6 Component outline and design

4.6.1 Drawing and specification

4.6.2 Pick-up area requirements

4.6.3 Bottom surface requirements

4.6.4 Requirements to terminals

4.6.5 Component height

4.6.6 Component weight

4.7 Mechanical stress

4.8 Component reliability

4.9 Additional requirements for compatibility with lead-free soldering

5 Specification of assembly process conditions

5.1 Mounting by soldering

5.2 Reflow soldering methods (recommended)

5.2.1 Vapour phase reflow soldering

5.2.2 Forced air convection reflow soldering

5.3 Cleaning (where applicable)

5.3.1 General

5.3.2 Fluid

5.3.3 Ultrasonic cleaning

5.3.4 Vapour

5.3.5 Spray

5.3.6 Plasma cleaning

5.4 Removal and/or replacement

5.4.1 Removal and/or replacement of soldered components

6 Typical process conditions

6.1 Printing of solder paste

6.2 Component insertion

6.3 Soldering processes, temperature/time profiles

6.3.1 Vapour phase soldering

6.3.2 Forced gas convection reflow soldering

6.4 Typical cleaning conditions for assemblies

6.5 Inspection of solder joints

7 Requirements for components and component specifications for THR soldering processes