What is this standard about?
This part of IEC 63011 specifies a reference model of through-silicon via (TSV) electrical characteristics required for an interface design in three dimensional integrated circuit (3-D IC) to transmit and receive digital data and measurement conditions for resistance and capacitance to specify TSV characteristics in 3-D IC.
3-D IC specifications covered by this document are the following:
• application: digital consumer and mobile;
• operating voltage: 0,1 V to 5,0 V,
• operating frequency: less than 2,0 GHz.
This document does not describe the equipment for the measurement.