BS EN 60068-2-69:2007outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices.
BS EN 60068-2-69:2007 is also available for surface mounting devices and should be consulted if applicable. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads.
BS EN 60068-2-69:2007provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.