BS IEC 61189-2-807. Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-807. Test methods for materials for interconnection structures. Decomposition Temperature (Td) using TGA

BS IEC 61189-2-807. Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-807. Test methods for materials for interconnection structures. Decomposition Temperature (Td) using TGA

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